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Shanghai Longway Special Glass Co., Ltd.
Verified Supplier
1 Years
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1 Years
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| Brand Name : | LONGWAY |
| Model Number : | KK253122 |
| Certification : | ISO9001 |
| Price : | NEGOTIATION |
| Payment Terms : | D/P,T/T,Western Union |
| Supply Ability : | 30000 Pieces per Month |
High Clarity Optical Borosilicate Glass Substrates In Semiconductor
Material:
Base Composition: Primarily silicon dioxide (SiO₂) and boron trioxide (B₂O₃) , with minimal alkali content.
Manufacturing: Produced via continuous melting in platinum-lined furnaces to ensure extreme purity and homogeneity. Often polished to sub-nanometer surface roughness.
Key Additives: Precise additions of alumina (Al₂O₃) for chemical stability and refining agents to eliminate bubbles/impurities.
Key Properties:
Exceptional Optical Clarity: Ultra-high light transmission (>90%) across UV to NIR spectra (e.g., 185nm-2μm), minimal autofluorescence.
Low Thermal Expansion (CTE): Extremely low CTE (∼3.3 × 10⁻⁶/K at 20°C), matching silicon wafers to prevent stress-induced failure during thermal cycling.
Superior Thermal & Chemical Resistance: Withstands aggressive semiconductor processes:
Thermal: Stable up to 500°C; resists thermal shock from rapid heating/cooling.
Chemical: Inert to acids, alkalis, and solvents (e.g., photoresist developers, etchants).
High Surface Quality: Near-atomic smoothness (<0.5nm Ra) critical for nanolithography and thin-film deposition.
Low Ionic Contamination: Minimal alkali ion migration (Na⁺, K⁺) prevents device contamination.
Mechanical Stability: High Young’s modulus (∼64 GPa) ensures dimensional rigidity under processing stress.
Primary Function:
To serve as an ultra-stable, inert platform for semiconductor fabrication processes.
Provides a defect-free surface for high-resolution patterning (e.g., EUV photomasks).
Acts as a protective window for sensors and optics in harsh environments.
Enables precise light transmission for inspection, metrology, and lithography systems.
Main Applications in Semiconductor:
Photomask Blanks: Base material for EUV/ArF photolithography masks requiring near-zero defects.
MEMS & Sensor Covers: Hermetic sealing caps for pressure sensors, IR detectors, and MEMS devices.
Wafer Handling Components: Carrier plates, inspection windows, and alignment stages in wafer processing tools.
Advanced Packaging: Interposers and substrates for 2.5D/3D IC integration.
Process Equipment Optics: Lenses, viewports, and mirrors in plasma etchers, CVD chambers, and laser tools.
Metrology & Inspection: Critical for high-precision alignment systems and defect scanners.
In essence: High Clarity Optical Borosilicate Glass Substrates are ultra-pure, thermally stable engineered materials essential for semiconductor manufacturing. Their unique combination of near-perfect optical transmission, near-zero thermal expansion, chemical inertness, and atomic-level surface flatness enables nanometer-scale precision in photolithography, protects sensitive components, and ensures reliability in extreme process environments. These substrates directly support yield and performance in advanced nodes (e.g., sub-5nm), MEMS production, and next-generation packaging.
| Item | Glass disc, Glass wafer, Glass substrate |
| Material | Optical glass, Qurartz glass, borosilicate glass, Float glass, borofloat |
| Diameter Tolerance | +0/-0.2 mm |
| Thickness Tolerance | +/-0.2 mm |
| Processed | By Cutting,Grinding,Tempering, Polishing |
| Surface Quality | 80/50,60/40,40/20 |
| Material Quality | No scratches and air bubble |
| Transmission | >90% for visible light |
| Chamfer | 0.1-0.3 mm x 45 degree |
| Surface Coating | Available |
| Usage | Photography, Optics, Lighting system, industrial area. |
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